EMI/EMC Parts & Solutions


EECOMP’s electromagnetic compatibility (EMC) solutions offer manufacturers wide range of standard and custom products, from component level which reduce or prevent electromagnetic interference (EMI) emission and shielding products to prevent EMI or noise from entering or leaving the device.

A good EMC goes a long way from a good printed-circuit board (PCB) layout design, grounding system, component selection and we are pride to be part of your EMC components solution partner with our wide components offering of Ferrite beads, inductors, RF Coils, Ferrite cores both in SMD and through-hole devices from various world class brand and manufacturers. Our principles are mainly high quality and cost-effective Taiwanese manufacturers along with OEM brand.

Once the circuit and PCB has been optimized for minimal emissions, the next stage is to shield critical sections of the board to provide isolation and to avoid any “leak”. Shielding can be a stand-alone solution, but by incorporating shielding considerations from beginning of the design process, designers can deliver a more cost-effective and generally more efficient system design.

Traditionally, EMI shielding has been fabricated from metal sheets and formed into shapes that fit enclosures. Today, EMI shielding materials include flexible metal films, metal wires, conductive-tapes, -foams, -gaskets in many shapes and size.

EMI shielding films and tapes are made from several different materials including Aluminium, nickel-plated fabric, embossed copper, tinned copper, and more. The type of metal use depends on the kind of application you will be using.

In addition to the off-the-shelf solutions, designers can work with us to create a custom shape to meet your specific system needs. Our brands are mostly from US, German and Korea reputable EMC manufacturer.

We also offer electrically inks coating that often paired with insulating coatings providing excellent attenuation, good thermal stability and abrasion- and solvent-resistance. Application method include pad printing, screen printing, spraying, dipping and syringe dispensing. Coatings can be applied to flexible or rigid substrates and be printed on uneven or contoured surfaces with good adhesion feature.